Cypress Computer Hardware CY62146DV30 User Manual

CY62146DV30  
4-Mbit (256K x 16) Static RAM  
an automatic power-down feature that significantly reduces  
power consumption. The device can also be put into standby  
mode reducing power consumption by more than 99% when  
Features  
• Very high speed: 45 ns  
deselected (CE HIGH). The input/output pins (I/O through  
0
• Wide voltage range: 2.20V–3.60V  
• Pin-compatible with CY62146CV30  
• Ultra-low active power  
I/O ) are placed in a high-impedance state when: deselected  
15  
(CE HIGH), outputs are disabled (OE HIGH), both Byte High  
Enable and Byte Low Enable are disabled (BHE, BLE HIGH),  
or during a write operation (CE LOW and WE LOW).  
— Typical active current: 1.5 mA @ f = 1 MHz  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
— Typical active current: 8 mA @ f = f  
• Ultra low standby power  
max  
(BLE) is LOW, then data from I/O pins (I/O through I/O ), is  
0
7
written into the location specified on the address pins (A  
0
• Easy memory expansion with CE, and OE features  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
through A ). If Byte High Enable (BHE) is LOW, then data  
17  
from I/O pins (I/O through I/O ) is written into the location  
8
15  
specified on the address pins (A through A ).  
0
17  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
• Packages offered 48-ball BGA and 44-pin TSOPII  
• Also available in Lead-free packages  
Functional Description[1]  
pins will appear on I/O to I/O . If Byte High Enable (BHE) is  
0
7
LOW, then data from memory will appear on I/O to I/O . See  
8
15  
The CY62146DV30 is a high-performance CMOS static RAM  
organized as 256K words by 16 bits. This device features ad-  
vanced circuit design to provide ultra-low active current. This  
the truth table at the back of this data sheet for a complete  
description of read and write modes.  
The CY62146DV30 is available in a 48-ball VFBGA, 44-pin  
TSOPII packages.  
is ideal for providing More Battery Life™ (MoBL ) in portable  
applications such as cellular telephones. The device also has  
Logic Block Diagram  
DATA IN DRIVERS  
A10  
A9  
A8  
A7  
A6  
A5  
A4  
A3  
A2  
256K x 16  
RAM Array  
I/O0–I/O7  
I/O8–I/O15  
A1  
A0  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Note:  
Cypress Semiconductor Corporation  
Document #: 38-05339 Rev. *A  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised February 2, 2005  
 
 
CY62146DV30  
DC Input Voltage  
.....................0.3V to V  
+ 0.3V  
Maximum Ratings  
CC(MAX)  
Output Current into Outputs (LOW)............................. 20 mA  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Static Discharge Voltage........................................... >2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .................................65°C to +150°C  
Latch-up Current......................................................>200 mA  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Operating Range  
Supply Voltage to Ground  
Ambient Tem-  
Potential......................................–0.3V to + V  
+ 0.3V  
+ 0.3V  
CC(MAX)  
.........................–0.3V to V  
CC(MAX)  
Device  
Range perature (T )  
V
CC  
A
DC Voltage Applied to Outputs  
CY62146DV30L Industrial –40°C to +85°C 2.20V to 3.60V  
CY62146DV30LL  
in High-Z State  
Electrical Characteristics Over the Operating Range  
CY62146DV30-45  
CY62146DV30-55  
CY62146DV30-70  
Parameter Description  
Test Conditions  
Min. Typ.  
2.0  
Max. Min. Typ.  
Max. Min. Typ.  
Max. Unit  
V
V
V
Output HIGH I = –0.1 mA V = 2.20V  
Voltage  
2.0  
2.4  
2.0  
2.4  
V
V
V
V
V
OH  
OL  
IH  
OH  
CC  
I
= –1.0 mA V = 2.70V  
2.4  
OH  
CC  
Output LOW I = 0.1 mA V = 2.20V  
Voltage  
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
OL  
CC  
I
= 2.1 mA V = 2.70V  
CC  
OL  
Input HIGH  
Voltage  
V
= 2.2V to 2.7V  
1.8  
2.2  
V
0.3V  
+
1.8  
2.2  
V
0.3V  
+
1.8  
2.2  
V
CC  
0.3V  
+
CC  
CC  
CC  
V
= 2.7V to 3.6V  
V
+
V
+
V
+
V
CC  
CC  
CC  
CC  
0.3V  
0.3V  
0.3V  
V
I
Input LOW  
Voltage  
V
V
= 2.2V to 2.7V  
= 2.7V to 3.6V  
–0.3  
–0.3  
–1  
0.6  
0.8  
+1  
–0.3  
–0.3  
–1  
0.6  
0.8  
+1  
–0.3  
–0.3  
–1  
0.6  
0.8  
+1  
V
V
IL  
CC  
CC  
InputLeakage GND < V < V  
Current  
µA  
IX  
I
CC  
I
I
Output  
Leakage  
Current  
GND < V < V , Output  
Disabled  
–1  
+1  
–1  
+1  
–1  
+1  
µA  
OZ  
O
CC  
V
f = f  
=
V
= V  
CCmax  
= 0 mA  
10  
20  
3
8
15  
3
8
15  
3
mA  
CC  
CC  
MAX  
CC  
Operating  
Supply  
Current  
1/t  
I
RC  
OUT  
CMOS levels  
f = 1 MHz  
1.5  
2
1.5  
2
1.5  
2
mA  
I
I
Automatic  
CE  
Power-down f = f  
Current —  
CMOS  
Inputs  
CE > V 0.2V,  
L
12  
8
12  
8
12  
8
µA  
SB1  
CC  
V >V –0.2V, V <0.2V)  
IN  
CC  
IN  
LL  
(Address and Data  
MAX  
Only),  
f = 0 (OE, WE, BHE and  
BLE), V = 3.60V  
CC  
Automatic  
CE  
Power-down 0.2V,  
CE > V – 0.2V,  
L
2
12  
8
2
12  
8
2
12  
8
µA  
SB2  
CC  
V
> V – 0.2V or V  
<
IN  
CC  
IN  
LL  
Current —  
f = 0, V = 3.60V  
CC  
CMOS Inputs  
Notes:  
6. V  
7. V  
= –2.0V for pulse durations less than 20 ns.  
IL(min.)  
= V +0.75V for pulse durations less than 20 ns.  
IH(max)  
CC  
8. Full device AC operation assumes a 100-µs ramp time from 0 to V (min) and 200 µs wait time after V stabilization.  
CC  
CC  
Document #: 38-05339 Rev. *A  
Page 3 of 11  
 
     
CY62146DV30  
Capacitance (for all packages)  
Parameter  
Description  
Test Conditions  
T = 25°C, f = 1 MHz,  
Max.  
10  
Unit  
pF  
C
C
Input Capacitance  
Output Capacitance  
IN  
A
V
= V  
CC  
CC(typ)  
10  
pF  
OUT  
Thermal Resistance[9]  
Parameter  
Description  
Test Conditions  
BGA  
TSOP II  
Unit  
Θ
Thermal Resistance  
(Junction to Ambient)  
Still Air, soldered on a 3 × 4.5 inch, four-layer  
printed circuit board  
72  
75.13  
°C/W  
JA  
Θ
Thermal Resistance  
(Junction to Case)  
8.86  
8.95  
°C/W  
JC  
AC Test Loads and Waveforms[10]  
R1  
ALL INPUT PULSES  
V
V
CC  
CC  
90%  
10%  
90%  
OUTPUT  
10%  
GND  
Fall Time = 1 V/ns  
Rise Time = 1 V/ns  
R2  
50 pF  
INCLUDING  
JIG AND  
SCOPE  
Equivalent to:  
THÉVENIN EQUIVALENT  
R
TH  
OUTPUT  
V
Parameters  
2.50V  
16667  
15385  
8000  
3.0V  
1103  
1554  
645  
Unit  
R1  
R2  
R
TH  
TH  
V
1.20  
1.75  
V
Data Retention Characteristics (Over the Operating Range)  
Parameter  
Description  
Conditions  
Min. Typ.  
Max. Unit  
V
V
for Data Retention  
1.5  
V
DR  
CC  
I
Data Retention Current  
V
= 1.5V  
L
9
6
µA  
CCDR  
CC  
CE > V – 0.2V,  
CC  
LL  
V
> V – 0.2V or V < 0.2V  
CC IN  
IN  
t
t
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
ns  
ns  
CDR  
t
R
RC  
Data Retention Waveform  
DATA RETENTION MODE  
> 1.5 V  
V
V
CC(min)  
CC(min)  
V
V
CC  
DR  
t
t
R
CDR  
CE  
Notes:  
9. Tested initially and after any design or process changes that may affect these parameters.  
10. Test condition for the 45 ns part is a load capacitance of 30 pF.  
11. Full device operation requires linear V ramp from V to V  
> 100 µs or stable at V  
> 100 µs.  
CC(min.)  
CC  
DR  
CC(min.)  
Document #: 38-05339 Rev. *A  
Page 4 of 11  
 
     
CY62146DV30  
Switching Characteristics Over the Operating Range  
45 ns  
55 ns  
70 ns  
Parameter  
Description  
Min.  
Max.  
Min.  
55  
Max.  
Min.  
70  
Max.  
Unit  
Read Cycle  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Read Cycle Time  
45  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
Address to Data Valid  
45  
55  
70  
AA  
Data Hold from Address Change  
CE LOW to Data Valid  
10  
10  
OHA  
ACE  
DOE  
LZOE  
HZOE  
LZCE  
HZCE  
PU  
45  
25  
55  
25  
70  
35  
OE LOW to Data Valid  
OE LOW to LOW Z  
5
10  
0
5
10  
0
5
10  
0
OE HIGH to High Z  
15  
20  
20  
20  
25  
25  
CE LOW to Low Z  
CE HIGH to High Z  
CE LOW to Power-Up  
CE HIGH to Power-Down  
BLE/BHE LOW to Data Valid  
45  
25  
55  
25  
70  
35  
PD  
DBE  
LZBE  
HZBE  
BLE/BHE LOW to Low Z  
10  
10  
10  
BLE/BHE HIGH to HIGH Z  
15  
20  
25  
Write Cycle  
t
t
t
t
t
t
t
t
t
t
t
Write Cycle Time  
45  
40  
40  
0
55  
40  
40  
0
70  
60  
60  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
CE LOW to Write End  
SCE  
AW  
Address Set-up to Write End  
Address Hold from Write End  
Address Set-up to Write Start  
WE Pulse Width  
HA  
0
0
0
SA  
35  
40  
25  
0
40  
40  
25  
0
45  
60  
30  
0
PWE  
BW  
BLE/BHE LOW to Write End  
Data Set-up to Write End  
Data Hold from Write End  
SD  
HD  
WE LOW to High-Z  
15  
20  
25  
HZWE  
LZWE  
WE HIGH to Low-Z  
10  
10  
10  
Notes:  
12. Test conditions for all parameters other than three-state parameters assume signal transition time of 3 ns (1V/ns) or less, timing reference levels of V  
/2,  
CC(typ)  
input pulse levels of 0 to V  
, and output loading of the specified I /I as shown in the “AC Test Loads and Waveforms” section.  
CC(typ.)  
OL OH  
13. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any  
HZCE  
LZCE HZBE  
LZBE HZOE  
LZOE  
HZWE  
LZWE  
given device.  
14. t  
, t  
, t  
, and t  
transitions are measured when the outputs enter a high-impedence state.  
HZOE HZCE HZBE  
HZWE  
15. The internal Write time of the memory is defined by the overlap of WE, CE = V , BHE and/or BLE = V . All signals must be ACTIVE to initiate a write and any  
IL  
IL  
of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates  
the write.  
Document #: 38-05339 Rev. *A  
Page 5 of 11  
 
       
CY62146DV30  
Switching Waveforms  
Read Cycle 1 (Address Transition Controlled)  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2 (OE Controlled)  
ADDRESS  
CE  
t
RC  
t
PD  
HZCE  
t
t
ACE  
OE  
t
HZOE  
t
DOE  
BHE/BLE  
t
LZOE  
t
HZBE  
t
DBE  
t
LZBE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PU  
V
I
CC  
CC  
SUPPLY  
CURRENT  
50%  
50%  
I
SB  
Notes:  
16. The device is continuously selected. OE, CE = V , BHE and/or BLE = V .  
IL  
IL  
17. WE is HIGH for read cycle.  
18. Address valid prior to or coincident with CE and BHE, BLE transition LOW.  
Document #: 38-05339 Rev. *A  
Page 6 of 11  
 
     
CY62146DV30  
Switching Waveforms (continued)  
Write Cycle No. 1 (WE Controlled)  
t
WC  
ADDRESS  
CE  
tSCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
BW  
BHE/BLE  
OE  
t
SD  
t
HD  
DATAIN  
DATA I/O  
NOTE 21  
t
HZOE  
[15, 19, 20]  
Write Cycle No. 2 (CE Controlled)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
t
HA  
AW  
tPWE  
WE  
t
BW  
BHE/BLE  
OE  
t
t
SD  
HD  
DATAIN  
DATA I/O  
NOTE 21  
t
HZOE  
Notes:  
19. Data I/O is high impedance if OE = V  
.
IH  
20. If CE goes HIGH simultaneously with WE = V , the output remains in a high-impedance state.  
IH  
21. During this period, the I/Os are in output state and input signals should not be applied.  
Document #: 38-05339 Rev. *A  
Page 7 of 11  
 
     
CY62146DV30  
Switching Waveforms (continued)  
Write Cycle No. 3 (WE Controlled, OE LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
BW  
BHE/BLE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
HD  
t
SD  
DATAI/O  
DATAIN  
t
HZWE  
t
LZWE  
Write Cycle No. 4 (BHE/BLE Controlled, OE LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
tBW  
BHE/BLE  
t
SA  
tPWE  
WE  
tHZWE  
tHD  
t
SD  
DATA I/O  
DATAIN  
tLZWE  
Document #: 38-05339 Rev. *A  
Page 8 of 11  
 
CY62146DV30  
Truth Table  
CE  
H
L
WE  
X
OE  
X
BHE  
X
BLE  
X
Inputs/Outputs  
High Z  
High Z  
Data Out (I/O –I/O  
Mode  
Deselect/Power-Down  
Output Disabled  
Read  
Power  
Standby (I  
)
SB  
X
X
H
H
Active (I  
Active (I  
Active (I  
)
CC  
L
H
L
L
L
)
)
CC  
O
15  
L
H
L
H
L
Data Out (I/O –I/O );  
Read  
)
CC  
O
7
I/O –I/O in High Z  
8
15  
L
H
L
L
H
Data Out (I/O –I/O );  
Read  
Active (I  
)
8
15  
CC  
I/O –I/O in High Z  
0
7
L
L
L
L
L
H
H
H
L
H
H
H
X
X
L
H
L
L
L
H
L
L
High Z  
Output Disabled  
Output Disabled  
Output Disabled  
Write  
Active (I  
Active (I  
Active (I  
Active (I  
Active (I  
)
CC  
High Z  
High Z  
)
CC  
)
CC  
L
Data In (I/O –I/O  
)
)
CC  
O
15  
L
H
Data In (I/O –I/O );  
Write  
)
CC  
O
7
I/O –I/O in High Z  
8
15  
L
L
X
L
H
Data In (I/O –I/O );  
Write  
Active (I  
)
8
15  
CC  
I/O –I/O in High Z  
0
7
Ordering Information  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
45  
CY62146DV30LL-45BVI  
CY62146DV30LL-45BVXI  
CY62146DV30LL-45ZSXI  
CY62146DV30L-55BVI  
CY62146DV30L-55BVXI  
BV48A 48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
Industrial  
48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm) (Pb-free)  
44-pin TSOP II (Pb-free)  
ZS-44  
55  
BV48A 48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
Industrial  
48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
(Pb-free)  
CY62146DV30LL-55BVI  
CY62146DV30LL-55BVXI  
48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
(Pb-free)  
CY62146DV30L-55ZSXI  
CY62146DV30LL-55ZSXI  
CY62146DV30L-70BVI  
CY62146DV30L-70BVXI  
ZS-44  
44-pin TSOP II (Pb-free)  
70  
BV48A 48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
Industrial  
Industrial  
48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
(Pb-free)  
CY62146DV30LL-70BVI  
CY62146DV30LL-70BVXI  
48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
48-ball Very Fine Pitch BGA (6 mm × 8mm × 1 mm)  
(Pb-free)  
CY62146DV30L-70ZSXI  
CY62146DV30LL-70ZSXI  
ZS-44  
44-pin TSOP II (Pb-free)  
Document #: 38-05339 Rev. *A  
Page 9 of 11  
 
CY62146DV30  
Package Diagram  
48-Lead VFBGA (6 x 8 x 1 mm) BV48A  
51-85150-*B  
44-Pin TSOP II ZS44  
51-85087-*A  
MoBL is a registered trademark, and More Battery Life is a trademark, of Cypress Semiconductor. All product and company  
names mentioned in this document may be the trademarks of their respective holders.  
Document #: 38-05339 Rev. *A  
Page 10 of 11  
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implDiesotwhantlothaedmfarnoumfacWturwerwa.sSsuommeasnaullarilssk.cofosmuc.hAulsleMaannduinadlsoinSgesaoricnhdeAmnndifieDsoCwypnrelosasda.gainst all charges.  
CY62146DV30  
Document History Page  
®
Document Title:CY62146DV30 MoBL 4-Mbit (256K x 16) Static RAM  
Document Number: 38-05339  
Orig. of  
REV.  
**  
ECN NO. Issue Date Change  
Description of Change  
213251  
316039  
See ECN  
See ECN  
AJU  
PCI  
New Data Sheet  
*A  
Added 45-ns Speed Bin in AC, DC and Ordering Information tables  
Added Footnote #10 on page #4  
Added Pb-free package ordering information on page # 9  
Changed 44-lead TSOP-II package name on page 10 from Z44 to ZS44  
Standardized Icc values across ‘L’ and ‘LL’ bins  
Document #: 38-05339 Rev. *A  
Page 11 of 11  
 

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